Laser processing is a technical application of high brightness (high power) and high directional characteristics of laser beams. The basic principle is to focus a laser beam with sufficient power (or energy) to illuminate the appropriate part of the material. After receiving the laser irradiation energy, the material begins to convert the light energy into heat within 10 seconds of the exposure. The parts heat up quickly. According to different illumination parameters, the material can undergo gasification, melting, metallographic structure changes and generate considerable thermal stress, so as to achieve the purpose of processing, removal, connection, modification and separation of the workpiece material.
Laser processing features
(1) Multi-function of one machine: It can complete cutting, punching, welding, surface treatment and other processing on the same machine tool, which can be processed step by step or at the same time. This is to improve production efficiency, especially for special positioning requirements such as fiber coupling. It has an unparalleled advantage over traditional processing.
(2) Strong adaptability: It can process various materials, including high hardness, high melting point, high strength and brittle, soft materials, which can be processed in the atmosphere or in vacuum.
(3) Good processing quality: Due to the high density of laser energy and non-contact flexible processing, it can be completed in an instant. The thermal deformation of the workpiece is extremely small and there is no mechanical deformation, which is very beneficial for the processing of precision small parts.
(4) High processing precision: For the emblem type gyro rotor, the laser dynamic balance technology is adopted, and the flat street precision can reach the mass eccentric value of one hundredth or several thousandths of a micrometer. Another example is the photochemical processing of excimer lasers. The photonic energy disk of excimer lasers is as high as 7.9 eV. A bond larger than many molecules can photolyze this molecule at a sufficiently high energy density and thus initiate or control the photochemical reaction. Excimer. Film deposition and removal are two examples.
(5) High processing efficiency: In some cases, laser cutting can improve the efficiency by 8 to 20 times, and the production efficiency of deep-melting welding with Aoguang is 30 times higher than the conventional method. Fine-tuning the thin film resistor with a laser can increase the work efficiency by 1000 times and improve the accuracy by 1-2 orders of magnitude. Laser enhanced plating. Its metal deposition rate can be increased by 1000 times. The diamond wire drawing film is mechanically punched for 24 hours, and the YAG laser hole is only required to be increased by 43200 times in 2 seconds. As for laser engraving and laser marking, the efficiency and labeling content are more difficult to meet with conventional processing methods.
(6) High economic efficiency: compared with other methods. The direct cost of laser drilling can be saved by 25% to 75%. Indirect processing costs can be saved by 50% to 75%. Compared with other cutting methods, laser cutting of side steel parts can reduce processing costs by 70% to 90%. The direct cost and overhead cost of laser automotive cylinder liner heat treatment can be reduced to l/3~1/4 of traditional processing methods.
(7) Energy saving and material saving: The energy utilization rate of the laser beam is 10 to 1000 times that of the conventional thermal processing technology, and the laser cutting can save materials by 15% to 30%.
(8) Pollution-free and pollution: the laser beam does not emit radiation such as an electron beam, and there is no processing pollution. There is no need to install a protective device.
Laser processing has a variety of characteristics. However, it is necessary to select the appropriate laser according to the processing characteristics of the workpiece to achieve optimal control of the irradiation energy density and the time limit. If the conditions of the laser, energy density and irradiation time are not properly selected, the processing effect is also not ideal.
